JPS5192064A - - Google Patents

Info

Publication number
JPS5192064A
JPS5192064A JP50017175A JP1717575A JPS5192064A JP S5192064 A JPS5192064 A JP S5192064A JP 50017175 A JP50017175 A JP 50017175A JP 1717575 A JP1717575 A JP 1717575A JP S5192064 A JPS5192064 A JP S5192064A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50017175A
Other languages
Japanese (ja)
Other versions
JPS5435666B2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1717575A priority Critical patent/JPS5435666B2/ja
Priority to US05/655,953 priority patent/US4092487A/en
Publication of JPS5192064A publication Critical patent/JPS5192064A/ja
Publication of JPS5435666B2 publication Critical patent/JPS5435666B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
JP1717575A 1975-02-11 1975-02-11 Expired JPS5435666B2 (en])

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1717575A JPS5435666B2 (en]) 1975-02-11 1975-02-11
US05/655,953 US4092487A (en) 1975-02-11 1976-02-06 Resin-sealed electrical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1717575A JPS5435666B2 (en]) 1975-02-11 1975-02-11

Publications (2)

Publication Number Publication Date
JPS5192064A true JPS5192064A (en]) 1976-08-12
JPS5435666B2 JPS5435666B2 (en]) 1979-11-05

Family

ID=11936607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1717575A Expired JPS5435666B2 (en]) 1975-02-11 1975-02-11

Country Status (2)

Country Link
US (1) US4092487A (en])
JP (1) JPS5435666B2 (en])

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51133749U (en]) * 1975-04-18 1976-10-28
JPS54119802A (en) * 1978-03-09 1979-09-18 Fuji Electric Co Ltd High voltage electrical equipment used under low atmospheric pressures
JPS5827941U (ja) * 1981-08-18 1983-02-23 日本インタ−ナシヨナル整流器株式会社 樹脂封止型電子機器
JPS60157243A (ja) * 1984-01-25 1985-08-17 Mitsubishi Electric Corp 半導体装置
JPS60242647A (ja) * 1984-05-16 1985-12-02 Mitsubishi Electric Corp 混成集積回路の実装方法
WO2013137013A1 (ja) 2012-03-14 2013-09-19 シャープ株式会社 洗浄装置および洗浄方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282544A (en) * 1977-12-12 1981-08-04 Motorola Inc. Encapsulated hybrid circuit assembly
US4248920A (en) * 1978-04-26 1981-02-03 Tokyo Shibaura Denki Kabushiki Kaisha Resin-sealed semiconductor device
US4268713A (en) * 1978-09-27 1981-05-19 Donley Robert P Flasher for vehicle lights
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
JPS59181627A (ja) * 1983-03-31 1984-10-16 Toshiba Corp 半導体装置の製造方法
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
EP0157938A3 (de) * 1984-03-23 1987-05-13 Siemens Aktiengesellschaft Gehäuse für elektrische Bauelemente
FR2614494B1 (fr) * 1987-04-22 1989-07-07 Power Compact Procede d'assemblage de circuits de puissance et de circuits de commande sur plusieurs niveaux sur un meme module et module ainsi obtenu
JP2569717B2 (ja) * 1987-06-05 1997-01-08 日本電装株式会社 樹脂封止型半導体装置およびその製造方法
US4903118A (en) * 1988-03-30 1990-02-20 Director General, Agency Of Industrial Science And Technology Semiconductor device including a resilient bonding resin
US5028984A (en) * 1988-11-04 1991-07-02 International Business Machines Corporation Epoxy composition and use thereof
US4960634A (en) * 1990-03-14 1990-10-02 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof
US5153368A (en) * 1991-05-28 1992-10-06 Ici Americas, Inc. Filtered electrical connection assembly using potted ferrite element
US5332944A (en) * 1993-10-06 1994-07-26 Cline David J Environmentally sealed piezoelectric switch assembly
US5883459A (en) * 1997-07-21 1999-03-16 Balboa Instruments Inc. Electrical switch assembly encapsulated against moisture intrusion
US6304232B1 (en) 2000-02-24 2001-10-16 The Goodyear Tire & Rubber Company Circuit module
WO2005096374A1 (de) * 2004-03-15 2005-10-13 Siemens Aktiengesellschaft Elektrotechnisches erzeugnis mit einem elektrischen bauelement und einer vergussmasse zur elektrischen isolierung des bauelements sowie verfahren zum herstellen des erzeugnisses
US6970360B2 (en) * 2004-03-18 2005-11-29 International Business Machines Corporation Tamper-proof enclosure for a circuit card
US11166363B2 (en) 2019-01-11 2021-11-02 Tactotek Oy Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2636073A (en) * 1950-12-19 1953-04-21 Bell Telephone Labor Inc Housing for electrical circuit units
US2882505A (en) * 1954-06-15 1959-04-14 Bell Telephone Labor Inc Potting of electrical apparatus
US3001105A (en) * 1956-11-30 1961-09-19 Arthur B Fox Glass beads as potting material for electronic assemblies
US3440589A (en) * 1966-04-01 1969-04-22 Brunswick Corp Resistor unit and method of making same
US3824328A (en) * 1972-10-24 1974-07-16 Texas Instruments Inc Encapsulated ptc heater packages
CH560999A5 (en]) * 1973-08-16 1975-04-15 Bbc Brown Boveri & Cie

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51133749U (en]) * 1975-04-18 1976-10-28
JPS54119802A (en) * 1978-03-09 1979-09-18 Fuji Electric Co Ltd High voltage electrical equipment used under low atmospheric pressures
JPS5827941U (ja) * 1981-08-18 1983-02-23 日本インタ−ナシヨナル整流器株式会社 樹脂封止型電子機器
JPS60157243A (ja) * 1984-01-25 1985-08-17 Mitsubishi Electric Corp 半導体装置
JPS60242647A (ja) * 1984-05-16 1985-12-02 Mitsubishi Electric Corp 混成集積回路の実装方法
WO2013137013A1 (ja) 2012-03-14 2013-09-19 シャープ株式会社 洗浄装置および洗浄方法

Also Published As

Publication number Publication date
US4092487A (en) 1978-05-30
JPS5435666B2 (en]) 1979-11-05

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